TÜBİTAK UZAY RELIABILITY CENTER'S CAPABILITIES

• Reliability knowledge and resource base to support the development of electronic systems for space and military state-of-the art equipment and complex systems, and also for commercial industry  by providing necessary laboratory infrastructure
• Planning of implementation of accelerated life testing employing temperature, pressure, vibration and power cycling stresses to find and improve weakness and estimate product life and decrease the time from design to market.
• Test capability infrastructure:
• Steady state temperature, thermal cyle, thermal shock, temperature-humudity-bias, vibration, HALT(Highly Accelerated life test)
• Microsectioning and microsection imaging with x10, x20, x40 magnification and more
• Static, dynamic and thermal FEM (finite element modeling) of solder joint and BGAs to predict and verify the failure behavior of electronic products.
• X-ray imaging for solder joint reliability
• Pull test for solder joints
• Surface insulation resistance test
• Cleanliness and contamination evaluation
• Infrared camera for thermal profile determination
• Root cause failure analysis
• Determination of failure mechanisms
• Reliability evaluation of RoHS complied lead-free electronics both for aerospace and commercial industry.
• Reliability evaluation of the electronic products in component, assembly and system level including long-term life.
• Implementation of physics of failure approaches in reliability and life prediction.
• Reliability modeling and life predictions with the use of appropriate software tools.
• FMECA (Failure modes, effects and criticality analysis), Worst Case Analysis (WCA), and Electronic Parts Stress Analysis (PSA).
• Analysis and tests performed  in accordance with IPC, JEDEC,MIL,IEC and ESA standards depending on the customer requirements.